| Speed | 667MHz |
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| Series | Zynq®-7000 |
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| RAM Size | 256KB |
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| Frequency | 667MHz |
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| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
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| Packaging | Tray |
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| Published | 2010 |
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| Part Status | Active |
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| Peripherals | DMA |
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| RoHS Status | Non-RoHS Compliant |
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| Architecture | MCU, FPGA |
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| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
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| Max Frequency | 667MHz |
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| Number of I/O | 130 |
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| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
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| Data Bus Width | 32b |
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| Package / Case | 900-BBGA, FCBGA |
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| Core Architecture | ARM |
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| Factory Lead Time | 10 Weeks |
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| Primary Attributes | Kintex™-7 FPGA, 444K Logic Cells |
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| Operating Temperature | -40°C~100°C TJ |
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| Supplier Device Package | 900-FCBGA (31x31) |
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| Max Operating Temperature | 100°C |
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| Min Operating Temperature | -40°C |
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| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
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